Gigabyte X670 GAMING X AX (rev. 1.0)

Specifications

  • Manufacturer: Gigabyte
  • Chipset: X670
  • Socket: AM5
  • Form Factor: ATX
  • DIMM Slots: 4
  • Color: Black

BIOS Update Status

  • AGESA 1.2.0.3C

    Improves high-density memory compatibility, allowing stable operation of 4x DIMM configurations and 256GB total capacity.

  • AGESA 1.2.7.0

    Major enablement patch for next-generation 2026 processors; updates the PSP firmware and improves USB compatibility.

  • AGESA 1.3.0.0

    Preliminary support for the next major AM5 architecture revision; includes significant security hardening and memory training overhauls.

Resources

BIOS Update Notifications

Latest BIOS Version

Version:F40
Release Date:2026-02-05

Checksum : A708 Improve system compatibility for BitLocker when using a dGPU card and LED lighting function.

BIOS Release Notes Analysis

Launch Stability & Compatibility

Initial firmware releases focus on stabilizing the AM5 platform and ensuring voltage safety for Ryzen 7000 series processors. Version vF5 integrates AGESA 1.0.0.5c to optimize performance for X3D variants, while vF6 implements a critical safety guardband that hard-locks the SoC voltage (VDDCR_SOC) to a maximum of 1.3V, preventing physical thermal damage to the CPU package. Version vF6 also enables support for non-binary 24GB and 48GB high-density DDR5 modules. Subsequent updates, including vF9, utilize AGESA 1.0.0.7c to significantly improve memory training algorithms, enabling higher frequency support for EXPO/XMP kits, while vF7 addresses specific vulnerabilities in the auto-download assistant reported by Eclypsium Research.

Feature Maturity & Hardware Support

Mid-cycle updates expand hardware compatibility to next-generation architectures and refine system performance. Support for Ryzen 8000 "Hawk Point" APUs is established in vF20 via AGESA 1.1.0.1, followed by the enablement of Ryzen 9000 "Granite Ridge" processors in vF30 (AGESA 1.1.7.0). Performance tuning for Zen 5 is advanced in vF32d and vF32f, which leverage AGESA 1.2.0.2a to introduce X3D Turbo Mode and optimize core latency. Additionally, vF32b unlocks a 105W TDP mode to boost multi-threaded throughput on 65W SKUs, while vF32g implements Zen5 Gaming Optimizations. Versions vF33a through vF33 further refine the platform with AGESA 1.2.0.3a, specifically targeting inter-core latency reductions for 2-CCD Ryzen 7000 and 9000 series CPUs.

Critical Security & Power Management

The firmware lifecycle addresses multiple high-severity Common Vulnerabilities and Exposures (CVEs) and hardware-level exploits. Version vF21 patches the LogoFAIL vulnerability, preventing malicious code execution during the DXE boot phase. The critical Sinkclose (SMM Lock Bypass) exploit is mitigated in vF32a via AGESA 1.2.0.1a, securing the system against ring -2 privilege escalation. Later updates, including vF35 and vF36 (AGESA 1.2.0.3e), resolve the TPM Out-of-Bounds Read flaw (CVE-2025-2884) and Microcode signature verification vulnerabilities (CVE-2024-36347). Finally, vF39 updates the platform to AGESA 1.2.8.0 to fix the Hynix Rowhammer vulnerability (CVE-2025-6202) affecting specific DDR5 memory modules.

ℹ️AI-synthesized summary derived from official changelogs and verified microcode specifications. Always verify with the manufacturer.