Gigabyte X570 AORUS XTREME (rev. 1.2)
Specifications
- Manufacturer: Gigabyte
- Chipset: X570
- Socket: AM4
- Form Factor: EATX
- DIMM Slots: 4
- Color: Black / Silver
Latest BIOS Version
Checksum : 1179 AMD AGESA ComboV2 1.2.0.F Update TPM-B FW for Raven2/ Picasso, Cezanne, Vermeer/ Matisse & Renoir CPUs Fix TPM2.0’s out-of-bounds read vulnerability (CVE-2025-2884)
BIOS Release Notes Analysis
Launch Stability & Compatibility
Initial firmware vF1 establishes platform support with AGESA 1.0.0.3, while vF3 updates to AGESA 1.0.0.3 ABB to resolve RDRAND instruction failures affecting Destiny 2. Support for Ryzen 5000 series processors is introduced in vF30 via AGESA ComboV2 1.0.8.1, followed by vF32 which integrates AGESA 1.1.0.0 D to enable Resizable BAR and improve USB 2.0 hub connectivity. Early system optimizations in vF10 (AGESA 1.0.0.4 B) reduce boot times and add support for Raven Ridge APUs.
Feature Maturity & Hardware Support
Hardware compatibility expands in vF36a, utilizing AGESA 1.2.0.6 B to support the Ryzen 7 5800X3D and restore the Max CPU Boost Clock Override option. Version F36 updates to AGESA 1.2.0.7, resolving widespread fTPM Stuttering issues caused by key validation latency in Windows. Version F35 implements AGESA 1.2.0.5, which introduces Capsule BIOS security architecture and enables fTPM by default for Windows 11 compliance. Support for Ryzen 5000 G-Series APUs is finalized in vF34 via AGESA 1.2.0.3 B.
Critical Security & Power Management
Recent updates focus on mitigating high-severity vulnerabilities. Version F38 integrates AGESA 1.2.0.B to address the Inception side-channel exploit and patches LogoFAIL image parsing vulnerabilities. The critical Sinkclose SMM lock bypass is resolved in vF39d via AGESA 1.2.0.Cc. Further hardening occurs in vF39g (AGESA 1.2.0.E), which fixes the microcode signature verification flaw CVE-2024-36347, while the final vF39 release (AGESA 1.2.0.F) resolves the TPM 2.0 out-of-bounds read vulnerability CVE-2025-2884.
ℹ️AI-synthesized summary derived from official changelogs and verified microcode specifications. Always verify with the manufacturer.
