ASRock B850M Pro Plus WiFi
Specifications
- Manufacturer: ASRock
- Chipset: B850
- Socket: AM5
- Form Factor: Micro ATX
- DIMM Slots: 4
- Color: Silver
BIOS Update Status
- AGESA 1.2.0.3C
Improves high-density memory compatibility, allowing stable operation of 4x DIMM configurations and 256GB total capacity.
- AGESA 1.2.7.0
Major enablement patch for next-generation 2026 processors; updates the PSP firmware and improves USB compatibility.
- AGESA 1.3.0.0
Preliminary support for the next major AM5 architecture revision; includes significant security hardening and memory training overhauls.
Latest BIOS Version
Update AGESA to ComboAM5 1.2.7.1 for upcoming CPU compatibility.SHA256: 95e5a021a1a7f4c7d5b31de27ba856c2b2a4a4dfa933e89ddc4b9feb6ec0edd1
BIOS Release Notes Analysis
System Stability & Architecture
The platform lifecycle begins with version v1.00, establishing the baseline initialization for the B850 chipset. Early post-launch optimization occurs in version v3.25, which integrates AGESA 1.2.0.3d to refine Precision Boost Overdrive (PBO) algorithms, improving voltage-frequency scaling logic. Significant architectural hardening is introduced in version v3.30 via AGESA 1.2.0.3e Patch A; based on technical specifications, this update mitigates the TPM Out-of-Bounds Read vulnerability (CVE-2025-2884) and finalizes voltage safety clamps for Ryzen 9000X3D series processors to prevent thermal excursions.
Performance Tuning & Latest Features
Mid-cycle updates focus on signal integrity and memory controller performance, with version v3.40 (AGESA 1.2.0.3f) enhancing DDR5 compatibility and resolving intermittent system stability issues. Following the minor revision in v3.50 (AGESA 1.2.0.3g), the firmware undergoes a major transition in version v4.03. This release implements AGESA 1.2.7.1, which updates the Platform Security Processor (PSP) firmware and enables preliminary support for next-generation 2026 processors, ensuring the socket remains compatible with future architecture revisions.
ℹ️AI-synthesized summary derived from official changelogs and verified microcode specifications. Always verify with the manufacturer.
