ASRock B850M-A
Specifications
- Manufacturer: ASRock
- Chipset: B850
- Socket: AM5
- Form Factor: Micro ATX
- DIMM Slots: 2
- Color: Black / Silver
BIOS Update Status
- AGESA 1.2.0.3C
Improves high-density memory compatibility, allowing stable operation of 4x DIMM configurations and 256GB total capacity.
- AGESA 1.2.7.0
Major enablement patch for next-generation 2026 processors; updates the PSP firmware and improves USB compatibility.
- AGESA 1.3.0.0
Preliminary support for the next major AM5 architecture revision; includes significant security hardening and memory training overhauls.
Latest BIOS Version
Update AGESA to ComboAM5 1.2.7.1 for upcoming CPU compatibility.SHA256: 4f742c7b8fa371d0c7b4a321c54c20080a75980382404f0283841065d6db0677
BIOS Release Notes Analysis
System Stability & Architecture
The B850 platform launched with version v1.00, establishing initial hardware support. Firmware development quickly advanced to version v3.25, which integrates AGESA 1.2.0.3d to optimize Precision Boost Overdrive (PBO) logic for improved thermal management. Significant security hardening was introduced in version v3.30 via AGESA 1.2.0.3e Patch A. This update mitigates the TPM Out-of-Bounds Read vulnerability (CVE-2025-2884) and implements refined voltage safety limits to protect Ryzen 9000X3D series processors from physical damage.
Performance Tuning & Latest Features
Operational stability was the focus of version v3.40, which updates to AGESA 1.2.0.3f to enhance DDR5 memory compatibility and resolve CPU stability variances. Following the iterative AGESA 1.2.0.3g update in version v3.50, the firmware underwent a major architectural shift in version v4.03. This release implements AGESA 1.2.7.1, which updates the Platform Security Processor (PSP) and enables preliminary support for next-generation 2026 processors.
ℹ️AI-synthesized summary derived from official changelogs and verified microcode specifications. Always verify with the manufacturer.