ASRock B650M-C

Specifications

  • Manufacturer: ASRock
  • Chipset: B650
  • Socket: AM5
  • Form Factor: Micro ATX
  • DIMM Slots: 4
  • Color: Black

BIOS Update Status

  • AGESA 1.2.0.3C

    Improves high-density memory compatibility, allowing stable operation of 4x DIMM configurations and 256GB total capacity.

  • AGESA 1.2.7.0

    Major enablement patch for next-generation 2026 processors; updates the PSP firmware and improves USB compatibility.

  • AGESA 1.3.0.0

    Preliminary support for the next major AM5 architecture revision; includes significant security hardening and memory training overhauls.

Resources

BIOS Update Notifications

Latest BIOS Version

Version:4.10
Release Date:2026-03-05

1. Update AGESA to ComboAM5 PI 1.3.0.0a.2. Optimized Memory Compatibility.3. Resolve a boot failure occurring on certain CPUs.SHA256: 7e6a8e79cbf2f0f277ce7f81dada8daa3dbe6283d1069560bfc06af2d0eb30f5

BIOS Release Notes Analysis

Launch Stability & Compatibility

The firmware lifecycle begins with v1.09, which integrates AGESA 1.0.0.3 to establish baseline DDR5 memory training algorithms and resolves hardware compatibility issues with GeForce RTX 40 series GPUs. Support for Ryzen 7000X3D processors is introduced in v1.19 via AGESA 1.0.0.5c, which also implements the PPM Provisioning Driver to prioritize V-Cache CCDs. Critical voltage regulation safeguards are enforced in v1.24 (AGESA 1.0.0.7a), which hard-locks the SoC voltage to a maximum of 1.3V to prevent physical thermal damage on Ryzen 7000X3D series processors.

Feature Maturity & Hardware Support

Memory controller performance is significantly improved in v1.29.AS01[Beta] through AGESA 1.0.0.7c, enabling support for high-speed DDR5 modules (6400MT/s+) and resolving boot failures on Samsung-based kits. The platform expands architecture support to Ryzen 8000G APUs in v2.02 (AGESA 1.1.0.0) and enables initial support for Ryzen 9000 'Granite Ridge' processors in v3.01 (AGESA 1.1.7.0). Advanced tuning capabilities arrive in v3.06 (AGESA 1.2.0.0a) with the introduction of Curve Shaper for distinct high/low-temperature undervolting, followed by the addition of a configurable 105W TDP mode for specific processors in v3.08.

Critical Security & Power Management

Firmware security is hardened in v2.06.AS03[Beta] (AGESA 1.1.0.2), which patches the LogoFAIL vulnerability to prevent DXE phase execution attacks. Optimization for Ryzen 9000 series continues in v3.08 (AGESA 1.2.0.2) by reducing inter-core latency, while v3.10 (AGESA 1.2.0.2a) refines thread scheduling logic for gaming workloads. Update v3.15 (AGESA 1.2.0.2b) addresses critical SMM vulnerabilities (AMD-SB-7027). Finally, v3.18.AS02[Beta] (AGESA 1.2.0.3a) finalizes support for Ryzen 9000X3D processors, and v3.30 (AGESA 1.2.0.3e) mitigates the TPM Out-of-Bounds Read vulnerability (CVE-2025-2884).

ℹ️AI-synthesized summary derived from official changelogs and verified microcode specifications. Always verify with the manufacturer.